Overview

It is generally acknowledged that modeling and simulation are preferred alternatives to trial and error approaches to semiconductor fabrication in the present environment, where the cost of process runs and associated mask sets is increasing exponentially with successive technology nodes. Hence, accurate physical device simulation tools are essential to accurately predict device and circuit performance.

Accurate thermal modelling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modelling methods that must be employed in order to determine a device's temperature profile.

ISBN-13

9781681740591

ISBN-10

1681740591

Weight

0.49 Pounds

Dimensions

7.00 x 0.22 x 10.00 In

List Price

$40.00

Format

Paperback

Language

English

Pages

107 pages

Publisher

Iop Concise Physics

Published On

2017-09-30



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