Overview

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

ISBN-13

9781441957696

ISBN-10

1441957693

Weight

1.74 Pounds

Dimensions

6.14 x 1.16 x 9.21 In

List Price

$24.99

Format

Paperback

Language

English

Pages

570 pages

Publisher

Springer

Published On

2013-04-30



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