3D Stacked Chips
Format: Paperback
ISBN13: 9783319793054
Paperback|9783319793054
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Overview
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
| ISBN-13 | 9783319793054 |
|---|---|
| ISBN-10 | 3319793055 |
| Weight | 1.12 Pounds |
| Dimensions | 6.10 x 0.82 x 9.25 In |
| List Price | $54.99 |
| Edition | 1st Edition |
| Format | Paperback |
|---|---|
| Language | English |
| Pages | xxiii, 339 pages |
| Publisher | Springer |
| Published On | 2018-05-26 |
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Alibris
Sparks, NV, USA
Print on demand Trade paperback (US). Glued binding. 339 p. Contains: Unspecified, Illustrations, b...
Free delivery by: 04 Apr 2026