3D Stacked Chips
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ISBN13: 9783319204819
|9783319204819
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Overview
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
| ISBN-13 | 9783319204819 |
|---|---|
| ISBN-10 | 3319204815 |
| List Price | $119.00 |
| Format | - |
|---|---|
| Language | English |
| Pages | 339 pages |
| Publisher | |
| Published On | 2016-06-07 |
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