3D Stacked Chips
Format: Hardcover
ISBN13: 9783319204802
Hardcover|9783319204802
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Overview
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
| ISBN-13 | 9783319204802 |
|---|---|
| ISBN-10 | 3319204807 |
| Weight | 1.85 Pounds |
| Dimensions | 6.14 x 0.81 x 9.21 In |
| List Price | $54.99 |
| Edition | 1st Edition |
| Format | Hardcover |
|---|---|
| Language | English |
| Pages | xxiii, 339 pages |
| Publisher | Springer |
| Published On | 2016-05-23 |
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Print on demand Sewn binding. Cloth over boards. 339 p. Contains: Unspecified, Illustrations, black...
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